Semiconductor Industry

SIASUN mobile robots provide precise logistics solutions for semiconductor wafer manufacturing (front-end). For the diffusion to metallization process, the robot flexibly plans the path according to the production cycle time and process requirements. In high-precision operation scenarios, its advanced navigation and positioning system ensures the smooth handling of wafers between processes to avoid collisions and contamination. The intelligent dispatching system coordinates the collaboration of multiple robots to improve the efficiency of material flow and reduce manpower dependence and operational errors. It meets the semiconductor industry's stringent demands for efficiency, precision and safety, promotes the advancement of wafer manufacturing logistics to intelligence and automation, and helps companies seize the initiative in fierce competition.

SIASUN's composite mobile robots excel in the traditional packaging (back-end) logistics of semiconductor wafers. From wafer thinning to testing processes, the robot accurately adapts to the material characteristics and working space of each link. It can gently carry chips after wafer cutting, stably transmit between wire bonding and molding, and efficiently transfer materials in electroplating and subsequent processes. With excellent positioning and load capacity, it can achieve seamless connection between processes, reduce errors and contamination caused by manual intervention, improve logistics speed and accuracy, ensure efficient and stable operation of semiconductor wafer packaging processes, and provide strong support for the intelligent upgrade of back-end processes in the semiconductor industry.

SIASUN mobile robots bring efficient logistics solutions to traditional semiconductor packaging (back-end). After the WB process, the robot accurately grabs the materials and smoothly transports them to the OVEN equipment, strictly following the process time and path planning to ensure timely and safe delivery of materials. After completing the OVEN process, it is quickly transferred to the PLASMA link, and with the help of advanced positioning and sensing technology, it can achieve precise docking with various equipment. The fully automated operation effectively avoids the mistakes and contamination that may be caused by manual handling, greatly improves logistics efficiency, ensures the continuity and stability of the back-end process of traditional semiconductor packaging, and helps companies improve production efficiency and product quality.